PART |
Description |
Maker |
BAS216 |
Small ceramic SMD package High switching speed:max. 4 ns
|
TY Semiconductor Co., Ltd
|
PL0066-WCW25 |
SMD High Power LED Ceramic Package
|
P-tec Corporation
|
PL0066-WCR33 |
SMD High Power LED Ceramic Package
|
P-tec Corporation
|
2N918CSM |
GENERAL PURPOSE/ SMALL SIGNAL NPN TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS GENERAL PURPOSE, SMALL SIGNAL NPN TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS VHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
|
SEME-LAB[Seme LAB] TT electronics Semelab, Ltd.
|
BMC0805HF-R27K BMC BMC0402HF-10NK BMC0402HF-12NK B |
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Surface Mount Multilayer High Frequency Ceramic Chip Inductors 0402 - 0805 Industry Sizes 1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
BITECH[Bi technologies] BI Technologies Corporation
|
2N4392CSM |
Small Signal N-Channal J-FET In a Hermetically Sealed Cermic Surface Mount Package For High Reliability Application(小信号N沟道结型场效应管(气密封口陶瓷表贴封装,高可靠性应用)) 小信号n -路通道J -在密封的六窑业表面贴装封装,高可靠性的应用场效应管(小信号沟道结型场效应管(气密封口陶瓷表贴封装,高可靠性应用) SMALL SIGNAL N.CHANNEL J.FET IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS
|
Unisonic Technologies Co., Ltd. SEME-LAB[Seme LAB] SemeLAB
|
AWSZTMXA-T AWSZTMXD-T AWSZTMXS-T AWSZTMGA-T AWSZTM |
CERAMIC RESONATOR, 2 MHz - 7.99 MHz SMD, 3 PIN CERAMIC RESONATOR, 20 MHz - 50 MHz SMD, 3 PIN CERAMIC RESONATOR, 13.01 MHz - 50 MHz SMD, 3 PIN CERAMIC RESONATOR, 8 MHz - 13 MHz SMD, 3 PIN HIGH FREQUENCY, WITHOUT BUILT-IN CAPACITORS SMD WASHABLE CERAMIC RESONATORS
|
Abracon, Corp. Abracon Corporation
|
555-0603 555-0603-10N-J-00 555-0603-1N8-M-00 555-0 |
1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Chip inductors, wire wound, surface mount, 0603 package
|
WEARNES CAMBION LTD CAMBION Electronic Components
|
LCWCP7P LCW-CP7P |
SMD Keramik Geh?use mit Silikonverguss und Linse SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
PM1008-10NM-RC PM1008-18NM-RC PM1008-12NM-RC PM100 |
High Q Chip Inductors SMD Inductor; Series:PM1008; Inductance:120nH; Inductance Tolerance: /- 10 %; Q Factor:60; Self Resonant Frequency:950MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:650mA SMD Inductor; Series:PM1008; Inductance:680nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:375MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:400mA SMD Inductor; Series:PM1008; Inductance:390nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:500MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:470mA SMD Inductor; Series:PM1008; Inductance:820nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:350MHz; Package/Case:1008; Terminal Type:Surface Mount; Core Material:Ceramic; Current Rating:400mA SMD Inductor; Series:PM1008; Inductance:3.3uH; Inductance Tolerance: /- 10 %; Q Factor:22; Self Resonant Frequency:110MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:290mA
|
Bourns Electronic Solutions BOURNS INC
|
CBR06C160FAGAC |
CBR-SMD RF C0G, Ceramic, High Q, 16 pF, 1%, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
|
Kemet Corporation
|
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